Article: Process Technology at IEDM 2008
By: David Kanter (email@example.com), August 3, 2009 1:22 am
Room: Moderated Discussions
Welcome back from an excellent weekend! To cheer up your Monday morning, I have completed a new article that reviews and analyzes the process technologies presented at IEDM 2008 and VLSI 2009:
This article discusses the industry wide move to 32nm process technologies with high-k dielectrics and metal gates. The techniques used to achieve this resolution include immersion lithography, double patterning and for some, off-axis illumination techniques.
Manufacturers presenting at these conferences include Intel, IBM/AMD SOI, IBM/AMD bulk, TSMC and Toshiba. We compare the results presented, showing an updated version of our process technology table and concluding with a new graphical comparison of the density and performance of various 45nm and 32nm process technologies.
Enjoy the reading, and I'll look forward to some interesting discussions and comments.