Article on 32nm process tech from IEDM 08 and VLSI 09 online

Article: Process Technology at IEDM 2008
By: David Kanter (dkanter.delete@this.realworldtech.com), August 3, 2009 1:22 am
Room: Moderated Discussions

Welcome back from an excellent weekend! To cheer up your Monday morning, I have completed a new article that reviews and analyzes the process technologies presented at IEDM 2008 and VLSI 2009:

http://www.realworldtech.com/page.cfm?ArticleID=RWT072109003617

This article discusses the industry wide move to 32nm process technologies with high-k dielectrics and metal gates. The techniques used to achieve this resolution include immersion lithography, double patterning and for some, off-axis illumination techniques.

Manufacturers presenting at these conferences include Intel, IBM/AMD SOI, IBM/AMD bulk, TSMC and Toshiba. We compare the results presented, showing an updated version of our process technology table and concluding with a new graphical comparison of the density and performance of various 45nm and 32nm process technologies.

Enjoy the reading, and I'll look forward to some interesting discussions and comments.


Regards,


David
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Article on 32nm process tech from IEDM 08 and VLSI 09 onlineDavid Kanter08/03/09 01:22 AM
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