IEDM 2005: Selected Coverage

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Introduction The 2005 International Electron Devices Meeting (IEDM) was held in the Hilton Hotel on Connecticut Ave in Washington DC from December 4 through December 7. In the four day period, 1800 attendees from all over the world listened to and examined materials presented on the state of the art in the field of semiconductor […]

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The Incredible Shrinking CPU

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This article discusses three problems facing modern high performance MPU architects: decreasing returns from ILP, increasing power dissipation and relatively constant interconnect performance.

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Coverage of IEDM 2003: AMD and Intel on Day 2

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Partial coverage of IEDM 2003 Day 2, focusing on AMD and Intel process technologies

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Coverage of IEDM 2003: Day 1

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IEDM coverage – Day 1

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Escape From the Planet of x86

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Paul discusses the history and future of x86, with an eye towards its potential successors

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The Stuff Dreams Are Made Of [Part 2]

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Part 2 of Paul’s investigation into CMOS, the device that has literally made the microprocessor industry

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Revisiting the FO4 Metric

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An in depth look at the FO4 metric used to validate circuit designs in microprocessors.

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The Stuff Dreams Are Made Of [Part 1]

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Paul looks a the basic building blocks of the devices that drive the tech industry – the CMOS.

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Making x86 Run Cool

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Paul investigates the diverging requirements of mobile x86 processors and speculates on what features we might see in upcoming mobile parts

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Notes from ISSCC 2001

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Paul DeMone gives a rundown of the interesting papers on microprocessor design from the last ISSCC Conference.

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