TSV + interposer

By: Groo (charlie.delete@this.semiaccurate.com), December 30, 2010 2:08 pm
Room: Moderated Discussions
arf (no@thanks.com) on 12/30/10 wrote:
---------------------------
>TSV is a step beyond SoC to attach pieces that can not ( and probably never) made on the same piece of silicon.
>That's why you see samsung and all Com Fabless companies so hot on TSV

I basically agree with everything but this. With TSVs you can make a stack of things that you can easily make on the same wafer, EG a DRAM stack. It might be more economical to make a stack, but it is easy enough to make a HUGE DRAM should the need arise. Ask IBM. :)

Also, stack != TSV, there are plenty of other ways to do it. TSVs are probably the most complex, expensive and error prone way to do it. You can wire bond them, use more complex packages, and other techniques.

-Charlie
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TopicPosted ByDate
Ivy Bridge and stacked DRAMDavid Kanter2010/12/29 02:06 PM
  Ivy Bridge and stacked DRAMGroo2010/12/29 04:31 PM
    Ivy Bridge and stacked DRAMRohit2010/12/30 12:02 AM
      Ivy Bridge and stacked DRAMGroo2010/12/30 01:20 PM
    Ivy Bridge and stacked DRAManon2010/12/30 03:26 AM
      Ivy Bridge and stacked DRAMGroo2010/12/30 01:23 PM
        Ivy Bridge and stacked DRAManon2010/12/30 03:59 PM
          Ivy Bridge and stacked DRAMGroo2010/12/30 07:24 PM
            64 bit LPDDR2 is enough for Ivy's 24EU IGP...Hans de Vries2010/12/30 11:54 PM
              64 bit LPDDR2 is enough for Ivy's 24EU IGP...Groo2011/01/01 01:07 PM
                64 bit LPDDR2 is enough for Ivy's 24EU IGP...Hans de Vries2011/01/07 06:27 PM
              64 bit LPDDR2 is enough for Ivy's 24EU IGP...IntelUser20002011/01/03 05:28 AM
          Ivy Bridge and stacked DRAMJouni Osmala2011/01/04 12:39 AM
        Ivy Bridge and stacked DRAManon2010/12/30 03:59 PM
  Ivy Bridge and stacked DRAMEuronymous2010/12/29 10:35 PM
    TSV + interposerDavid Kanter2010/12/29 11:36 PM
      TSV + interposerEuronymous2010/12/30 06:25 AM
      TSV + interposerarf2010/12/30 12:11 PM
        TSV dimensions vs. metal layersDavid Kanter2010/12/30 12:33 PM
          TSV dimensions vs. metal layersarf2010/12/30 03:24 PM
            TSV dimensions vs. metal layersDavid Kanter2010/12/30 06:10 PM
        TSV + interposerGroo2010/12/30 02:08 PM
          TSV + interposerDavid Kanter2010/12/30 02:45 PM
            TSV + interposerGroo2010/12/30 07:22 PM
    Ivy Bridge and stacked DRAMGroo2010/12/30 01:26 PM
  Ivy Bridge and stacked DRAMajensen2010/12/30 03:50 AM
  512-bit without TSV?M.Isobe2010/12/30 06:47 AM
    Multiple interposers are needed for ultra-wide interfaceM.Isobe2010/12/30 07:12 AM
  Stacked DRAM: Good for what it is intendedWill Smith2011/01/03 05:37 AM
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