I recently completed a semiconductor manufacturing article that tracks the various disclosures at IEDM and VLSI over the last two years. In essence, it's a recap of everything that has gone on since my last article on IEDM (http://www.realworldtech.com/page.cfm?ArticleID=RWT072109003617). Here's a short blurb:

The integration predicted by Moore's Law is fundamentally driven by advances in semiconductor manufacturing. One of the key challenges is scaling to ever finer and denser geometries, while improving the performance of transistors. IEDM and the VLSI Symposium are the premier venues to discuss the challenges and opportunities for future process technologies. No commercial 22nm process technologies were presented at IEDM 2010, but in the last two years a number of advances have been disclosed, both for high performance and low power applications. This article describes several 32nm and 28nm nodes from Intel, IBM’s Common Platform and TSMC, plus novel applications such as IBM’s 32nm eDRAM that have been disclosed at IEDM and VLSI.

Link: http://www.realworldtech.com/page.cfm?ArticleID=RWT021511004545

As always, comments and feedback are welcome.

David

PS: There is a fair bit of information on various analog/RF components, although it is by no means exhaustive.