Article: 22nm Design Challenges at ISSCC 2011
By: Nathan Monson (nmo.delete@this.spamaway.com), March 15, 2011 8:17 am
Room: Moderated Discussions
someone (someone@somewhere.com) on 3/15/11 wrote:
---------------------------
>Wow, that's brutal. The U.S. graduates about 13k EEs a year
>last I heard. There were about in 100 in my graduating year
>at my school.
67% of graduate level EEs in the US are foreign-born [1]. This matches my experience hiring newly minted EEs in Silicon Valley. (This isn't anything glamorous like chip design, just typical mixed signal motherboards for consumer electronics.)
Somehow, a lot of Americans are getting the message that EE is a dead-end.
In one ear, I'm hearing from trained EEs who are not interested in making a career of it anymore, because 'it's all going to be outsourced anyway'. In the other ear, my managers are getting impatient with how long it takes to find a good EE locally, when the guys overseas swear they can handle it immediately with armies of warm bodies for a fraction of the cost.
Nathan
[1] http://www.h1base.com/visa/work/US%20ECONOMY%20and%20the%20H1B%20VISA%20program/ref/1210/
---------------------------
>Wow, that's brutal. The U.S. graduates about 13k EEs a year
>last I heard. There were about in 100 in my graduating year
>at my school.
67% of graduate level EEs in the US are foreign-born [1]. This matches my experience hiring newly minted EEs in Silicon Valley. (This isn't anything glamorous like chip design, just typical mixed signal motherboards for consumer electronics.)
Somehow, a lot of Americans are getting the message that EE is a dead-end.
In one ear, I'm hearing from trained EEs who are not interested in making a career of it anymore, because 'it's all going to be outsourced anyway'. In the other ear, my managers are getting impatient with how long it takes to find a good EE locally, when the guys overseas swear they can handle it immediately with armies of warm bodies for a fraction of the cost.
Nathan
[1] http://www.h1base.com/visa/work/US%20ECONOMY%20and%20the%20H1B%20VISA%20program/ref/1210/
Topic | Posted By | Date |
---|---|---|
Design Challenges at 22nm Article | David Kanter | 2011/03/14 12:36 AM |
Design Challenges at 22nm Article | Dean Calver | 2011/03/14 01:06 AM |
Design Challenges at 22nm Article | David Kanter | 2011/03/14 08:06 PM |
Design Challenges at 22nm Article | savantu | 2011/03/15 04:25 AM |
Roots of this problem go way back. | someone | 2011/03/14 06:00 AM |
Education | Moritz | 2011/03/15 03:42 AM |
Education | someone | 2011/03/15 06:26 AM |
Education | Moritz | 2011/03/15 11:44 AM |
Education | sylt | 2011/03/18 09:31 AM |
Roots of this problem go way back. | Rob Thorpe | 2011/03/15 05:25 AM |
Roots of this problem go way back. | someone | 2011/03/15 06:20 AM |
Roots of this problem go way back. | Nathan Monson | 2011/03/15 08:17 AM |
Roots of this problem go way back. | mpx | 2011/03/15 11:55 AM |
Roots of this problem go way back. | Mark Roulo | 2011/03/15 01:34 PM |
Roots of this problem go way back. | Rob Thorpe | 2011/03/15 03:42 PM |
Roots of this problem go way back. | Paul | 2011/03/15 04:03 PM |
Roots of this problem go way back. | Dean Kent | 2011/03/15 07:11 AM |
Design Challenges at 22nm Article | Daniel Bizo | 2011/03/14 06:06 AM |
Design Challenges at 22nm Article | Linus Torvalds | 2011/03/14 08:48 AM |
Design Challenges at 22nm Article | David Kanter | 2011/03/14 08:20 PM |
Design Challenges at 22nm Article | Dean Kent | 2011/03/15 07:16 AM |
Design Challenges at 22nm Article | David Kanter | 2011/03/14 09:05 AM |
Could you elaborate? | Daniel Bizó | 2011/03/16 05:43 AM |
IDM trade offs | David Kanter | 2011/03/16 09:54 AM |
Design Challenges at 22nm Article | Tianyi | 2012/10/17 11:24 PM |