Article: 22nm Design Challenges at ISSCC 2011
By: Daniel Bizo (dbizo.delete@this.idc.com), March 14, 2011 6:06 am
Room: Moderated Discussions
David Kanter (dkanter@realworldtech.com) on 3/14/11 wrote:
---------------------------
>As Moore's Law continues, each new generation of semiconductor manufacturing is
>ushered in by new challenges, hurdles and solutions. At ISSCC 2011, a panel with
>speakers from Global Foundries, IBM, Intel, Renesas and TSMC discussed manufacturing
>and circuit design interactions at the upcoming 22nm node. Industry leaders have
>reached a broad technical consensus, although with several subtle differences.
>This report explores the key challenges and solutions at 22nm; focusing on variation
>and co-optimization between design and manufacturing. As a result of the needed
>collaboration, understanding of physical design and manufacturing is even more critical
>to cutting edge chip development and achieving good performance, power and yields.
>
>http://www.realworldtech.com/page.cfm?ArticleID=RWT031411013528
>
>As always, comments and feedback are welcome.
>
>David
A conclusion not articulated by the article itself is that the IDM model becomes even more desirable for those who can economically afford and sustain it. Chip desingers which can keep financing cutting edge process R&D and manufacturing will increasingly levarage the integrated model unless they badly screw up on the architectural side.
Is this knowledge priced into the INTC vs. AMD vs. ARM world expectations? Don`t think so. OTOH, it is interesting to see how limited market impact IBM has with Power7 no matter how big an engineering success it is.
---------------------------
>As Moore's Law continues, each new generation of semiconductor manufacturing is
>ushered in by new challenges, hurdles and solutions. At ISSCC 2011, a panel with
>speakers from Global Foundries, IBM, Intel, Renesas and TSMC discussed manufacturing
>and circuit design interactions at the upcoming 22nm node. Industry leaders have
>reached a broad technical consensus, although with several subtle differences.
>This report explores the key challenges and solutions at 22nm; focusing on variation
>and co-optimization between design and manufacturing. As a result of the needed
>collaboration, understanding of physical design and manufacturing is even more critical
>to cutting edge chip development and achieving good performance, power and yields.
>
>http://www.realworldtech.com/page.cfm?ArticleID=RWT031411013528
>
>As always, comments and feedback are welcome.
>
>David
A conclusion not articulated by the article itself is that the IDM model becomes even more desirable for those who can economically afford and sustain it. Chip desingers which can keep financing cutting edge process R&D and manufacturing will increasingly levarage the integrated model unless they badly screw up on the architectural side.
Is this knowledge priced into the INTC vs. AMD vs. ARM world expectations? Don`t think so. OTOH, it is interesting to see how limited market impact IBM has with Power7 no matter how big an engineering success it is.
| Topic | Posted By | Date |
|---|---|---|
| Design Challenges at 22nm Article | David Kanter | 2011/03/14 12:36 AM |
| Design Challenges at 22nm Article | Dean Calver | 2011/03/14 01:06 AM |
| Design Challenges at 22nm Article | David Kanter | 2011/03/14 08:06 PM |
| Design Challenges at 22nm Article | savantu | 2011/03/15 04:25 AM |
| Roots of this problem go way back. | someone | 2011/03/14 06:00 AM |
| Education | Moritz | 2011/03/15 03:42 AM |
| Education | someone | 2011/03/15 06:26 AM |
| Education | Moritz | 2011/03/15 11:44 AM |
| Education | sylt | 2011/03/18 09:31 AM |
| Roots of this problem go way back. | Rob Thorpe | 2011/03/15 05:25 AM |
| Roots of this problem go way back. | someone | 2011/03/15 06:20 AM |
| Roots of this problem go way back. | Nathan Monson | 2011/03/15 08:17 AM |
| Roots of this problem go way back. | mpx | 2011/03/15 11:55 AM |
| Roots of this problem go way back. | Mark Roulo | 2011/03/15 01:34 PM |
| Roots of this problem go way back. | Rob Thorpe | 2011/03/15 03:42 PM |
| Roots of this problem go way back. | Paul | 2011/03/15 04:03 PM |
| Roots of this problem go way back. | Dean Kent | 2011/03/15 07:11 AM |
| Design Challenges at 22nm Article | Daniel Bizo | 2011/03/14 06:06 AM |
| Design Challenges at 22nm Article | Linus Torvalds | 2011/03/14 08:48 AM |
| Design Challenges at 22nm Article | David Kanter | 2011/03/14 08:20 PM |
| Design Challenges at 22nm Article | Dean Kent | 2011/03/15 07:16 AM |
| Design Challenges at 22nm Article | David Kanter | 2011/03/14 09:05 AM |
| Could you elaborate? | Daniel Bizó | 2011/03/16 05:43 AM |
| IDM trade offs | David Kanter | 2011/03/16 09:54 AM |
| Design Challenges at 22nm Article | Tianyi | 2012/10/17 11:24 PM |
