Article: AMD's Mobile Strategy
By: Megol (golem960.delete@this.gmail.com), January 11, 2012 3:51 am
Room: Moderated Discussions
Mark Roulo (nothanks@xxx.com) on 1/10/12 wrote:
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>Jason Chan (jchan@gmail.com) on 1/10/12 wrote:
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>>Bill Henkel on 12/29/11 wrote:
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>>> For desktops and workstations, a differentiator could be
>>> higher single thread performance rather than more cores
>>> per socket (e.g. a 6 GHz dual-core water-cooled processor).
>>
>>The power consumption of a 6 GHz dual-core x86 processor would not need to be higher
>>than Sandy Bridge-EP so water cooling would not be necessary. Suppose ...
>
>There are probably a lot of issues with this, but one obvious one is heat/power
>*DENSITY*. Trying to pull 150 watts out of a 30 mm^2 die is probably quite a challenge.
>
>I think that the PowerPC 970 had this problem ...
Shouldn't a vapor chamber system with the silicon die exposed (boiling on the silicon surface) work?
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>Jason Chan (jchan@gmail.com) on 1/10/12 wrote:
>---------------------------
>>Bill Henkel on 12/29/11 wrote:
>>---------------------------
>>> For desktops and workstations, a differentiator could be
>>> higher single thread performance rather than more cores
>>> per socket (e.g. a 6 GHz dual-core water-cooled processor).
>>
>>The power consumption of a 6 GHz dual-core x86 processor would not need to be higher
>>than Sandy Bridge-EP so water cooling would not be necessary. Suppose ...
>
>There are probably a lot of issues with this, but one obvious one is heat/power
>*DENSITY*. Trying to pull 150 watts out of a 30 mm^2 die is probably quite a challenge.
>
>I think that the PowerPC 970 had this problem ...
Shouldn't a vapor chamber system with the silicon die exposed (boiling on the silicon surface) work?