By: Shiv (no.delete@this.e.mail), February 23, 2014 9:59 pm
Room: Moderated Discussions
Doug S (foo.delete@this.bar.bar) on February 23, 2014 12:09 pm wrote:
> Or do something like this?
> http://www.thruchip.com/index.htm
For a stack of identical cache chips, I guess the cache chips would have to be offset to wire bond the power connections to the cache chips. If ThruChip is overly greedy like Rambus, no one will do this until the patents expire. It's theoretically possible that good sense could prevail in the licensing of this technology. The stack of cache chips would not have to be on top of the processor if that would be too hot.
> Or do something like this?
> http://www.thruchip.com/index.htm
For a stack of identical cache chips, I guess the cache chips would have to be offset to wire bond the power connections to the cache chips. If ThruChip is overly greedy like Rambus, no one will do this until the patents expire. It's theoretically possible that good sense could prevail in the licensing of this technology. The stack of cache chips would not have to be on top of the processor if that would be too hot.
