By: David Hess (davidwhess.delete@this.gmail.com), January 15, 2018 6:29 pm
Room: Moderated Discussions
David Kanter (dkanter.delete@this.realworldtech.com) on January 15, 2018 9:57 am wrote:
>
> ...
>
> Intel’s engineers essentially backported
> the second and third generation FinFETs from the 10nm and 14nm processes to 22FFL, improving performance
> and power efficiency with superior fin geometry and workfunction metals. Intel also created a large
> library of digital and analog transistors and passive components.
I always wondered if features introduced in more advanced processes were backported to larger feature sizes. Now I know. Thanks David.
>
> ...
>
> Intel’s engineers essentially backported
> the second and third generation FinFETs from the 10nm and 14nm processes to 22FFL, improving performance
> and power efficiency with superior fin geometry and workfunction metals. Intel also created a large
> library of digital and analog transistors and passive components.
I always wondered if features introduced in more advanced processes were backported to larger feature sizes. Now I know. Thanks David.