Why no EMIB?

By: useruser (user.delete@this.user.user), November 6, 2018 10:41 am
Room: Moderated Discussions
Kevin G (kevin.delete@this.cubitdesigns.com) on November 6, 2018 8:06 am wrote:
> anon.1 (abc.delete@this.def.com) on November 6, 2018 7:15 am wrote:
> > anon (anon.delete@this.mailinator.com) on November 6, 2018 3:31 am wrote:
> > > dmcq (dmcq.delete@this.fano.co.uk) on November 6, 2018 2:45 am wrote:
> > > > Anandtech outlined a new Intel multi-chip packkage
> > > > Intel Goes For 48-Cores: Cascade-AP with Multi-Chip Package Coming Soon
> > > > but says they're not using EMIB, do you think perhaps Anandtech are wrong or why would
> > > > they not use EMIB? It seems made for the job and a unique advantage for Intel.
> > >
> > > EMIB requires the chips it's used with to be designed for it. This 48-core CPU just
> > > appears to be two existing Cascade Lake SP chips shipped in a single package, communicating
> > > through the same links they would be in a multi-socket system.
> > >
> > > If Intel designs a new chip specifically for use in such a system, they would probably use EMIB.
> > >
> > >
> >
> > Is it possible to put 2x 200W dies maybe a mm apart and not run into mechanical stresses
> > or thermal issues? So far, we've seen EMIB as a product used only on AMD Vega part on Intel
> > MCM. They chose not to put the CPUGPU interface on EMIB. Maybe there were legit management
> > reasons (schedule, time to market, complexity, working with another company etc), but that
> > would've been a great test vehicle for the idea and they didn't go all the way.
> EMIB is used on some FPGA parts like the Stratix 10 which have up to six EMIB tiles.
> Leveraging EMIB for a PCIe 8x link between the Vega GPU and Kaby Lake die would
> not have been a wise decision as it would not have brought performance increase
> or significant power consumption decreases. It would still have been an 8x link.
In addition, a PCIe8 socket on a mobo only has 98 wires (~1/3 of them ground), compared to at least 1024 for the HBM2 interface on the Kaby-Lake-Vega part. In that package, they were reducing the vertical height of the overall package, since the interposer was removed. This allowed the CPU, GPU, and HBM2 to share the same heatpipe, a likely consideration for laptop heatsinks.
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TopicPosted ByDate
Why no EMIB?dmcq2018/11/06 03:45 AM
  Why no EMIB?anon2018/11/06 04:31 AM
    Why no EMIB?anon.12018/11/06 08:15 AM
      Why no EMIB?Kevin G2018/11/06 09:06 AM
        Why no EMIB?useruser2018/11/06 10:41 AM
        Why no EMIB?anon.12018/11/07 08:00 AM
          Why no EMIB?Jeff S.2018/11/07 09:45 AM
      Why no EMIB?David Hess2018/11/09 09:43 PM
        Why no EMIB?dmcq2018/11/10 07:35 AM
          Why no EMIB?Maynard Handley2018/11/10 09:27 AM
          Why no EMIB?David Hess2018/11/10 09:37 AM
  TTMDaniel B2018/11/06 02:21 PM
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