Why no EMIB?

By: dmcq (dmcq.delete@this.fano.co.uk), November 10, 2018 7:35 am
Room: Moderated Discussions
David Hess (davidwhess.delete@this.gmail.com) on November 9, 2018 8:43 pm wrote:
> anon.1 (abc.delete@this.def.com) on November 6, 2018 7:15 am wrote:
> >
> > Is it possible to put 2x 200W dies maybe a mm apart and not run into mechanical stresses
> > or thermal issues?
>
> Having so much power dissipated over a limited surface area by two devices is merely inconvenient. A 3x3
> array with the same close spacing would be a major problem because of access to the die in the center.
>
> Mechanical stress depends on matching the temperature coefficient of expansion between the silicon and anything
> attached to it like the lead frame, substrate, die attachment, and heat spreader. If a socket is used, then
> this only has to be handled by the packaging but it becomes a major issue with BGA packages soldered to standard
> printed circuit boards as nVidia has demonstrated for more than 10 years. Lead free solder made this considerably
> worse because the more ductile leaded solders have greater mechanical compliance.

As a matter of interest why are substrates hard rather than soft and leaving the connections within them to flex?
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TopicPosted ByDate
Why no EMIB?dmcq2018/11/06 03:45 AM
  Why no EMIB?anon2018/11/06 04:31 AM
    Why no EMIB?anon.12018/11/06 08:15 AM
      Why no EMIB?Kevin G2018/11/06 09:06 AM
        Why no EMIB?useruser2018/11/06 10:41 AM
        Why no EMIB?anon.12018/11/07 08:00 AM
          Why no EMIB?Jeff S.2018/11/07 09:45 AM
      Why no EMIB?David Hess2018/11/09 09:43 PM
        Why no EMIB?dmcq2018/11/10 07:35 AM
          Why no EMIB?Maynard Handley2018/11/10 09:27 AM
          Why no EMIB?David Hess2018/11/10 09:37 AM
  TTMDaniel B2018/11/06 02:21 PM
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