Why no EMIB?

By: David Hess (davidwhess.delete@this.gmail.com), November 10, 2018 9:37 am
Room: Moderated Discussions
dmcq (dmcq.delete@this.fano.co.uk) on November 10, 2018 6:35 am wrote:
> David Hess (davidwhess.delete@this.gmail.com) on November 9, 2018 8:43 pm wrote:
> >
> > Mechanical stress depends on matching the temperature coefficient
> > of expansion between the silicon and anything
> > attached to it like the lead frame, substrate, die attachment,
> > and heat spreader. If a socket is used, then
> > this only has to be handled by the packaging but it becomes
> > a major issue with BGA packages soldered to standard
> > printed circuit boards as nVidia has demonstrated for more
> > than 10 years. Lead free solder made this considerably
> > worse because the more ductile leaded solders have greater mechanical compliance.
>
> As a matter of interest why are substrates hard rather than
> soft and leaving the connections within them to flex?

As far as I know, a flexible substrate would make attachment less reliable.
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TopicPosted ByDate
Why no EMIB?dmcq2018/11/06 03:45 AM
  Why no EMIB?anon2018/11/06 04:31 AM
    Why no EMIB?anon.12018/11/06 08:15 AM
      Why no EMIB?Kevin G2018/11/06 09:06 AM
        Why no EMIB?useruser2018/11/06 10:41 AM
        Why no EMIB?anon.12018/11/07 08:00 AM
          Why no EMIB?Jeff S.2018/11/07 09:45 AM
      Why no EMIB?David Hess2018/11/09 09:43 PM
        Why no EMIB?dmcq2018/11/10 07:35 AM
          Why no EMIB?Maynard Handley2018/11/10 09:27 AM
          Why no EMIB?David Hess2018/11/10 09:37 AM
  TTMDaniel B2018/11/06 02:21 PM
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