AnandTech SPEC2006 scores for ARM SoC

By: David Hess (davidwhess.delete@this.gmail.com), November 9, 2018 3:31 pm
Room: Moderated Discussions
Maynard Handley (name99.delete@this.name99.org) on November 9, 2018 8:02 am wrote:
> David Hess (davidwhess.delete@this.gmail.com) on November 9, 2018 6:43 am wrote:
> >
> > I think the problem is the practical value; the applications which call for this sort of thing operate over
> > a longer period of time and nobody cares about only seconds
> > to minutes. If a copper or aluminum heat spreader
> > is used in a high power application, then it covers short spans of time. It would be cheaper to install
> > a copper/water heat pipe which has less thermal capacity but makes up for it with a large surface area on
> > the radiating side and they make heat pipes for exactly this sort of heat spreading application.
>
> It sounds like you are thinking of this in the context of a PC.
> I was more curious the extent to which one can do something useful in the context of mobile, so watch to
> phone to tablet sized, with a large radiator as impractical, and where short-ish bursts of performance might
> conceivably be useful. (Perhaps, eg, people playing games for 5 minutes while they wait in line.)
>

No, I was thinking specifically about a mobile where space and weight are constrained. On a PC, the answer is simple and a phase change heat sink would never be used in place of a larger heat spreader and heat pipe.

Indeed, a heat pipe *is* a phase change heat sink but one which operates between liquid and gas phases instead of between solid and liquid phases. It provides massive thermal conductivity at the expense of limited power/area at the hot end which is why a heat pipe requires a heat spreader in most applications.

The reason I think using a phase change heat sink is uneconomical is that a heat pipe like I described would work even better for the same cost and with enough area on the cold side which is certainly available, the temperature rise on the cold side is small. They even make exactly the type of required planar heat pipe for special applications; it looks like a giant copper cracker. Of course it makes the phone thicker so is useless to Apple. If manufacturers are not using them, then it is because the added cost is not worth the improvement in performance.
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