IBM Going with Samsung after dumping GlobalFoundries

By: Maynard Handley (name99.delete@this.name99.org), December 20, 2018 7:43 pm
Room: Moderated Discussions
itsmydamnation (no.delete@this.way.com) on December 20, 2018 2:02 pm wrote:
> Anon (Anon.delete@this.anon.com) on December 20, 2018 11:07 am wrote:
> > https://newsroom.ibm.com/2018-12-20-IBM-Expands-Strategic-Partnership-with-Samsung-to-Include-7nm-Chip-Manufacturing
>
> This was the thing i actually wondered about most when GF made the 7nm abandonment announcement.
> How much process development capability does IBM have left? Will IBM work with Samsung
> to develop things like edram for their 7nm process, can it already do it?
>
> Its going to be interesting to exactly what the 7nm power chips look like.

There are many ways to skin a cat. IBM may perhaps have to give up on-chip eDRAM, but as a replacement they may be able to use some sort of die-die stacking to put a massive L3 cache as a separate die under the logic die. (To goose the performance a little, you could also do mid-90s things like have on-logic-die tags for the L3, with the L3 data on the separate die, but I don't know if that's worth the hassle.)

The point of this exercise is that it would take advantage of directions that Samsung is probably already good at or wants to be good at (die on die stacking) rather than requiring a very expensive process stream that no-one outside IBM cares about or is willing to pay for.

And once you've accepted this sort of model, multiple implementation options present themselves. The eDRAM die could still be manufactured at GF. Or (if it makes sense) an MRAM die could be used in its place.

One of the current roadblocks (perhaps THE big roadblock right now) to more aggressive die stacking is not actually stacking the dies, or alignment, or thermal issues, or anything like that; it's that design tools are still very far from being set up handle multi-layer/3D designs. But logic stacked on a cache is about the simplest sort of SoC system one can envisage, and that is well-partitioned enough that it seems to be a feasible first step, even with the current state of design tools.
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TopicPosted ByDate
IBM Going with Samsung after dumping GlobalFoundriesAnon2018/12/20 12:07 PM
  IBM Going with Samsung after dumping GlobalFoundriesitsmydamnation2018/12/20 03:02 PM
    IBM Going with Samsung after dumping GlobalFoundriesanon2018/12/20 04:50 PM
    IBM Going with Samsung after dumping GlobalFoundriesMaynard Handley2018/12/20 07:43 PM
      IBM Going with Samsung after dumping GlobalFoundriesMichael S2018/12/21 04:46 AM
        IBM Going with Samsung after dumping GlobalFoundriesanon2018/12/21 06:30 AM
          IBM Going with Samsung after dumping GlobalFoundriesMichael S2018/12/21 07:39 AM
            IBM Going with Samsung after dumping GlobalFoundriesanon2018/12/21 08:24 AM
            Definitely a mistakeDavid Kanter2018/12/21 09:09 AM
              Definitely a mistakeMichael S2018/12/22 08:45 AM
                Definitely a mistakedmcq2018/12/22 11:26 AM
                Definitely a mistakeRobert Williams2018/12/22 11:40 AM
                Definitely a mistakesomeone2018/12/22 01:46 PM
                L1 caches are SRAMDavid Kanter2018/12/22 02:27 PM
                Definitely a mistakeanon2018/12/22 02:30 PM
                Definitely a mistakecarop2018/12/22 08:09 PM
                L1 caches are SRAMjuanrga2018/12/23 05:23 AM
    IBM Going with Samsung after dumping GlobalFoundriesDavid Kanter2018/12/20 09:28 PM
      IBM Going with Samsung after dumping GlobalFoundriesKevin G2018/12/21 08:57 AM
        Samsung fabbed Alpha 21164A chips in 1996/7Mark Roulo2018/12/21 05:24 PM
          Samsung fabbed Alpha 21164A chips in 1996/7Kevin G2018/12/25 03:03 PM
      IBM Going with Samsung after dumping GlobalFoundriesAdrian2018/12/21 11:55 PM
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