eDRAM too expensive

By: Adrian (a.delete@this.acm.org), January 14, 2019 12:44 pm
Room: Moderated Discussions
Ricardo B (ricardo.b.delete@this.xxxxx.xx) on January 14, 2019 11:06 am wrote:
> Adrian (a.delete@this.acm.org) on January 13, 2019 8:51 pm wrote:
> >
> > 2. The new I/O dies also need higher speed SERDES for the other interfaces, e.g. for
> > the inter-chip links, probably up to at least 20 Gb/s, more likely up to 25 Gb/s.
> >
> > Such SERDES designs were already existing and proven for the IBM process, while the original
> > Zen 14 nm process seemed to not be able to reach serial speeds much above 10 Gb/s.
>
> I double GloFo 14 nm process is a limiting factor for SERDES speed.
>
> Here, a 28 Gbit/s SERDES implemented in TSMC 28 nm.
> https://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=6894632
>
>
>


I do not have any information about the TSMC 28 nm and newer processes, because I have designed CMOS ICs only down to 45 nm and even then not for the TSMC processes but for IBM/Samsung processes.


Nevertheless, I doubt that things have changed a lot during the last decade.

This paper describes an implementation in a process that offered not only logic transistors but also well characterized analog transistors, bump inductors and metal-insulator-metal capacitors.

Back when I still had access to CMOS process data, such components were not available in the base CMOS processes used for implementing processors or memories, but only in more expensive process variants intended for implementing devices with RF parts, e.g. WiFi or phone modems.


Because of this, I doubt that the described SERDES is implemented in the same 28 nm process as that used e.g. for ARM processors or for GPUs.


Nevertheless, it is possible that the continuous increase in the speed of the serial interfaces might have forced the availability of good analog components even in the standard logic CMOS processes.

Still, I find it difficult to believe this, because the IC designers have always requested such devices but the process designers have always been extremely reluctant to provide them.



Regarding Zen, we know that the serial interfaces already consume a quite large part of the total power. Doubling or tripling the speed might increase the power consumption of the interfaces to unacceptable levels.

This could be mitigated by a more clever design, but I doubt that the first Zen generation was very far from an optimal design.

If they do not use the IBM process, then it is still very likely that they do not use the original GloFo 14 nm process but some tweaked variant, e.g. one with better passive components (inductors & capacitors), which were not available the first time when Zen was designed.















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