By: Andrey (andrey.semashev.delete@this.gmail.com), July 27, 2021 12:33 pm
Room: Moderated Discussions
Kester L (nobody.delete@this.nothing.com) on July 27, 2021 8:29 am wrote:
> https://www.anandtech.com/show/16823/intel-accelerated-offensive-process-roadmap-updates-to-10nm-7nm-4nm-3nm-20a-18a-packaging-foundry-emib-foveros
>
> Intel finally announced their upcoming roadmap and finally renamed
> their nodes to match TSMC and Samsung's marketing numbers.
This is stupid and wasted opportunity. They could have dropped the whole size-related connotation in the process names, which has no relation to reality anyway, and go with whatever marketing naming scheme they wanted. Instead they just renamed their nodes to one step ahead to "look good" compared to TSMC. In reality it doesn't make Intel look good, it makes it look desperate.
> https://www.anandtech.com/show/16823/intel-accelerated-offensive-process-roadmap-updates-to-10nm-7nm-4nm-3nm-20a-18a-packaging-foundry-emib-foveros
>
> Intel finally announced their upcoming roadmap and finally renamed
> their nodes to match TSMC and Samsung's marketing numbers.
This is stupid and wasted opportunity. They could have dropped the whole size-related connotation in the process names, which has no relation to reality anyway, and go with whatever marketing naming scheme they wanted. Instead they just renamed their nodes to one step ahead to "look good" compared to TSMC. In reality it doesn't make Intel look good, it makes it look desperate.