Kester L (nobody.delete@this.nothing.com) on July 27, 2021 8:29 am wrote:
> https://www.anandtech.com/show/16823/intel-accelerated-offensive-process-roadmap-updates-to-10nm-7nm-4nm-3nm-20a-18a-packaging-foundry-emib-foveros
>
> Intel finally announced their upcoming roadmap and finally renamed
> their nodes to match TSMC and Samsung's marketing numbers.

I was pretty excited to finally see Intel reveal some long term plans.

I thought there were a few really interesting tidbits:

1. The backside power delivery looks really neat. Seems like a lot of benefits from separating data and power, using different metals and different geometries.

2. It's great to see Intel finally using ODI (Foveros omni). That's a great packaging technology that is super elegant. It provides a way do use nice fat copper pillars for power delivery to a top die in a stack. This avoids the penalties associated with doing power delivery through TSVs.

Anyway, it sounds like Meteor Lake uses ODI and probably granite rapids as well. Should be pretty cool!

David