David Kanter (dkanter.delete@this.realworldtech.com) on September 27, 2021 10:04 am wrote:

> are much smaller. It's also possible that EUV will help get back on track.

I have doubts. I think it will be a a one time solution or two full nodes at best and then we are back to quadruple patterning.

> it would be strictly better.

Yes, but also in cost?
Will the defect density ever reach the same level as 14nm and earlier for reference?
Will the gains out-weigh the increase in processing steps and machining costs?

> I think cost effective heterogeneous integration will change the rules of the game a lot!

Let's hope there is economy of scale. There were reasons why it was not done in the past.
Smaller than PCB integration is moving the production away from low wage low tech manufacturing to more centralized, monopolized, sophisticated packaging plants. Not sure how cost effective that is.

Will this lead to a reevaluation of 450mm wafers? In 2017 the industry concluded that 450mm was not economical. Is it now or do they want to start more wafers in an increased number of legacy fabs?
I do not see how the later is economical.