By: Moritz (better.delete@this.not.tell), September 28, 2021 9:55 am
Room: Moderated Discussions
Doug S (foo.delete@this.bar.bar) on September 28, 2021 7:53 am wrote:
> Even if they did 450 mm fabs it would only be for future processes. No one is going
> to design and sell fab equipment to handle 450 mm wafers in a legacy process.
And that is not what I had in mind. There are too many ways to integrate and stack inside a package but some of those ways require silicon interposer with Through Silicon Vias.
Where will those come from? What manufacturing capacity will they cut into?
> It has been clear since well before 2017 that 450 mm was never going to happen, and is still
> clear today.
Nothing of relevance has changed?
> Anyway, there is at least now plenty of learned experience with multiple
> patterning if/when that's needed again for a few critical layers.
I am talking about cost not feasibility.
.
> Even if they did 450 mm fabs it would only be for future processes. No one is going
> to design and sell fab equipment to handle 450 mm wafers in a legacy process.
And that is not what I had in mind. There are too many ways to integrate and stack inside a package but some of those ways require silicon interposer with Through Silicon Vias.
Where will those come from? What manufacturing capacity will they cut into?
> It has been clear since well before 2017 that 450 mm was never going to happen, and is still
> clear today.
Nothing of relevance has changed?
> Anyway, there is at least now plenty of learned experience with multiple
> patterning if/when that's needed again for a few critical layers.
I am talking about cost not feasibility.
.