new cost structure and integration

By: Moritz (better.delete@this.not.tell), September 28, 2021 9:55 am
Room: Moderated Discussions
Doug S (foo.delete@this.bar.bar) on September 28, 2021 7:53 am wrote:

> Even if they did 450 mm fabs it would only be for future processes. No one is going
> to design and sell fab equipment to handle 450 mm wafers in a legacy process.

And that is not what I had in mind. There are too many ways to integrate and stack inside a package but some of those ways require silicon interposer with Through Silicon Vias.
Where will those come from? What manufacturing capacity will they cut into?

> It has been clear since well before 2017 that 450 mm was never going to happen, and is still
> clear today.

Nothing of relevance has changed?

> Anyway, there is at least now plenty of learned experience with multiple
> patterning if/when that's needed again for a few critical layers.

I am talking about cost not feasibility.
.
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TopicPosted ByDate
fab capacity or Why are there no GPUs (by Nvidia) to be had?Moritz2021/09/22 06:40 AM
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      fab capacity or Why are there no GPUs (by Nvidia) to be had?Captain Obvious2021/09/23 11:16 AM
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              new cost structure and integrationDoug S2021/09/28 07:53 AM
                new cost structure and integrationMoritz2021/09/28 09:55 AM
              new cost structure and integrationGroo2021/09/29 07:45 AM
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