By: tacobell (vasco.costa.delete@this.gmail.com), August 6, 2022 5:39 am
Room: Moderated Discussions
David Kanter (dkanter.delete@this.realworldtech.com) on June 12, 2022 7:05 pm wrote:
> The Intel 4 process achieves 20% better performance and scales logic density by 2X while reducing costs
> through extensive design co-optimization, adoption of new materials, and judicious use of EUV lithography.
> The first product, the Meteor Lake compute tile will ramp to high volume manufacturing in 2023.
Great news! I thought the high-end US semi industry in the fabrication space was bound for collapse at this rate.
What about those small high-efficiency cores which Jim Keller designed? When are those coming into service? I think the product was supposed to be called Ice Lake.
> The Intel 4 process achieves 20% better performance and scales logic density by 2X while reducing costs
> through extensive design co-optimization, adoption of new materials, and judicious use of EUV lithography.
> The first product, the Meteor Lake compute tile will ramp to high volume manufacturing in 2023.
Great news! I thought the high-end US semi industry in the fabrication space was bound for collapse at this rate.
What about those small high-efficiency cores which Jim Keller designed? When are those coming into service? I think the product was supposed to be called Ice Lake.
