Groo (charlie.delete@this.semiaccurate.com) on June 26, 2022 9:39 am wrote:
> rwessel (rwessel.delete@this.yahoo.com) on June 25, 2022 11:43 am wrote:
> > anon (myname.delete@this.gmail.com) on June 25, 2022 11:34 am wrote:
> > > Would a hexagonal die make better use of the round ingot?mail
> >
> > You're going to have a heck of a time sawing these dies appart:
> >
> Not really, I got a hexagonal die wafer in my office and have seen some very non-regular dies out there.
>
> https://www.semiaccurate.com/2015/05/18/disco-makes-hexagonal-non-regular-chips-possible/
>
> It is a tad more expensive but not a significant cost in relation to a finished wafer on a modern
> process. The biggest reason you don't want to do it is the loss of edge area for I/O.
>
> -Charlie

Thanks very much for that. Pulling them apart like perforated paper - I'd never have thought of that.