Doug S (foo.delete@this.bar.bar) on June 26, 2022 12:05 pm wrote:
> Groo (charlie.delete@this.semiaccurate.com) on June 26, 2022 9:41 am wrote:
> > Doug S (foo.delete@this.bar.bar) on June 25, 2022 11:39 am wrote:
> > > anon (myname.delete@this.gmail.com) on June 25, 2022 11:34 am wrote:
> > > > Would a hexagonal die make better use of the round ingot?mail
> > > >
> > >
> > >
> > > EUV scanners have a given slit width and scan linearly.
> > > It isn't possible to make dies that aren't rectangular.
> >
> > You are making assumptions that could be rectified with very few lines of code.
>
>
> Are you saying the slit size be dynamically changed while
> scanning across the wafer for each field/chip/image?
>
> I assumed not (because that added complexity is useless if you're making rectangular chips) but if it can be
> done at great enough precision you're right, the EUV hardware wouldn't be a barrier to making hexagonal dies.

All I am saying is that die boundaries are arbitrary and don't have to have relevance to the tools. There are reasons for boundaries, reticle size for example, but within those hard limits there is a lot that can be done.

-Charlie