IEDM Coverage - Day 2, Online

Article: Coverage of IEDM 2003: AMD and Intel on Day 2
By: G Webb (glwebb.delete@this.acm.org), December 13, 2003 10:38 am
Room: Moderated Discussions
Thanks.

Does it suggest that Intel is going to get excellent yields
with Prescott but that clock speed is unlikely to ramp up
quickly due to high leakage, unless some industry wide
effort on cooling, board design and casing occurs.

I've seen it be suggested that future heatsinks may need
to fastened to the case itself rather than the board,
and that ducting may become mandatory.
< Previous Post in ThreadNext Post in Thread >
TopicPosted ByDate
IEDM Coverage - Day 2, OnlineDean Kent2003/12/13 01:39 AM
  IEDM Coverage - Day 2, OnlineG Webb2003/12/13 10:38 AM
    IEDM Coverage - Day 2, OnlineDavid Wang2003/12/13 11:15 AM
      Cooling solutionsDean Kent2003/12/13 12:36 PM
        Cooling solutionsG Webb2003/12/13 12:51 PM
      IEDM Coverage - Day 2, OnlineG Webb2003/12/13 12:39 PM
        InterestingDavid Kanter2003/12/13 12:51 PM
        IEDM Coverage - Day 2, OnlineDavid Wang2003/12/13 12:53 PM
      IEDM Coverage - Day 2, OnlineJosé Javier Zarate2003/12/14 04:41 PM
  Good stuff (NT)Singh, S.R.2003/12/13 01:06 PM
Reply to this Topic
Name:
Email:
Topic:
Body: No Text
How do you spell purple?