By: slacker (sla.delete@this.c.ker), May 7, 2007 1:40 am
Room: Moderated Discussions
rwessrl (robertwessel@yahoo.com) on 5/7/07 wrote:
---------------------------
>With the top-down front-to-back stacked approach, how thick are the upper layers
>of the stack? I got the impression that these layers are only a few microns thick.
The upper layers are the thickness of the bulk substrate: 300-500 microns (assuming that they are not thinned)
>I assume that the back-side vias are made with an extended time implantation procedure,
>so that you have an n or p well that's substantially deeper than the surrounding
>transistor structures? Or do they use something more exotic and actually etch a hole and fill it with metal or poly?
Actually etch a hole
>Does this start with an ultra thin wafer, or is the top layer somehow cut off after processing?
Wafers are thinned (ground).
>And how to you reliably handle these (presumably) ultra thin slices?
Carefully (mechanical rigidity is a problem).
---------------------------
>With the top-down front-to-back stacked approach, how thick are the upper layers
>of the stack? I got the impression that these layers are only a few microns thick.
The upper layers are the thickness of the bulk substrate: 300-500 microns (assuming that they are not thinned)
>I assume that the back-side vias are made with an extended time implantation procedure,
>so that you have an n or p well that's substantially deeper than the surrounding
>transistor structures? Or do they use something more exotic and actually etch a hole and fill it with metal or poly?
Actually etch a hole
>Does this start with an ultra thin wafer, or is the top layer somehow cut off after processing?
Wafers are thinned (ground).
>And how to you reliably handle these (presumably) ultra thin slices?
Carefully (mechanical rigidity is a problem).
| Topic | Posted By | Date |
|---|---|---|
| 3D Integration article by new author | David Kanter | 2007/05/06 07:50 PM |
| 3D Integration article by new author | rwessrl | 2007/05/07 01:10 AM |
| 3D Integration article by new author | slacker | 2007/05/07 01:40 AM |
| 3D Integration article by new author | rwessel | 2007/05/07 01:57 AM |
| 3D Integration article by new author | yoyo | 2007/05/07 05:47 AM |
| 3D Integration article by new author | Wierdo | 2007/05/08 05:57 AM |
| 3D Integration article by new author | Marcin Niewiadomski | 2007/05/10 12:14 PM |