3D Integration article by new author

Article: 3D Integration: A Revolution in Design
By: rwessel (robertwessel.delete@this.yahoo.com), May 7, 2007 1:57 am
Room: Moderated Discussions
slacker (sla@c.ker) on 5/7/07 wrote:
---------------------------
>Actually etch a hole
>
>>Does this start with an ultra thin wafer, or is the top layer somehow cut off after processing?
>
>Wafers are thinned (ground).


So these are actually ground down to a couple of microns after processing? Yikes. Or am I misunderstanding the point of the die cross section micrographs on page 5 of the article?

Is this done mechanically, or is it chemically milled?
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3D Integration article by new authorDavid Kanter2007/05/06 07:50 PM
  3D Integration article by new authorrwessrl2007/05/07 01:10 AM
    3D Integration article by new authorslacker2007/05/07 01:40 AM
      3D Integration article by new authorrwessel2007/05/07 01:57 AM
        3D Integration article by new authoryoyo2007/05/07 05:47 AM
  3D Integration article by new authorWierdo2007/05/08 05:57 AM
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