By: rwessel (robertwessel.delete@this.yahoo.com), May 7, 2007 12:57 am
Room: Moderated Discussions
slacker (sla@c.ker) on 5/7/07 wrote:
---------------------------
>Actually etch a hole
>
>>Does this start with an ultra thin wafer, or is the top layer somehow cut off after processing?
>
>Wafers are thinned (ground).
So these are actually ground down to a couple of microns after processing? Yikes. Or am I misunderstanding the point of the die cross section micrographs on page 5 of the article?
Is this done mechanically, or is it chemically milled?
---------------------------
>Actually etch a hole
>
>>Does this start with an ultra thin wafer, or is the top layer somehow cut off after processing?
>
>Wafers are thinned (ground).
So these are actually ground down to a couple of microns after processing? Yikes. Or am I misunderstanding the point of the die cross section micrographs on page 5 of the article?
Is this done mechanically, or is it chemically milled?
| Topic | Posted By | Date |
|---|---|---|
| 3D Integration article by new author | David Kanter | 2007/05/06 06:50 PM |
| 3D Integration article by new author | rwessrl | 2007/05/07 12:10 AM |
| 3D Integration article by new author | slacker | 2007/05/07 12:40 AM |
| 3D Integration article by new author | rwessel | 2007/05/07 12:57 AM |
| 3D Integration article by new author | yoyo | 2007/05/07 04:47 AM |
| 3D Integration article by new author | Wierdo | 2007/05/08 04:57 AM |
| 3D Integration article by new author | Marcin Niewiadomski | 2007/05/10 11:14 AM |