By: yoyo (no.delete@this.thanks.com), May 7, 2007 5:47 am
Room: Moderated Discussions
rwessel (robertwessel@yahoo.com) on 5/7/07 wrote:
---------------------------
>slacker (sla@c.ker) on 5/7/07 wrote:
>---------------------------
>>Actually etch a hole
>>
>>>Does this start with an ultra thin wafer, or is the top layer somehow cut off after processing?
>>
>>Wafers are thinned (ground).
>
>
>So these are actually ground down to a couple of microns after processing? Yikes.
>Or am I misunderstanding the point of the die cross section micrographs on page 5 of the article?
>
>Is this done mechanically, or is it chemically milled?
>
mechanically
"Grinder" polishes back side of the wafer with thin diamond disks
---------------------------
>slacker (sla@c.ker) on 5/7/07 wrote:
>---------------------------
>>Actually etch a hole
>>
>>>Does this start with an ultra thin wafer, or is the top layer somehow cut off after processing?
>>
>>Wafers are thinned (ground).
>
>
>So these are actually ground down to a couple of microns after processing? Yikes.
>Or am I misunderstanding the point of the die cross section micrographs on page 5 of the article?
>
>Is this done mechanically, or is it chemically milled?
>
mechanically
"Grinder" polishes back side of the wafer with thin diamond disks
| Topic | Posted By | Date |
|---|---|---|
| 3D Integration article by new author | David Kanter | 2007/05/06 07:50 PM |
| 3D Integration article by new author | rwessrl | 2007/05/07 01:10 AM |
| 3D Integration article by new author | slacker | 2007/05/07 01:40 AM |
| 3D Integration article by new author | rwessel | 2007/05/07 01:57 AM |
| 3D Integration article by new author | yoyo | 2007/05/07 05:47 AM |
| 3D Integration article by new author | Wierdo | 2007/05/08 05:57 AM |
| 3D Integration article by new author | Marcin Niewiadomski | 2007/05/10 12:14 PM |
