3D Integration article by new author

Article: 3D Integration: A Revolution in Design
By: Wierdo (a.delete@this.b.com), May 8, 2007 5:57 am
Room: Moderated Discussions
David Kanter (dkanter@realworldtech.com) on 5/6/07 wrote:
>I'd like to thank Euronymous, our newest contributor, who has just posted an article to RWT from MICRO-39.
>This report details one of the most important future technologies for semiconductors:
>three dimensional integration. Academic and industrial researchers at Intel and
>IBM have made it clear that 3D integration is the future for semiconductor manufacturing.
>This report explains the major motivations and challenges for 3D integration, how
>this technique works, and the preliminary results that 3D integration can offer for modern microprocessors.
>The article can be found at:
>Thanks to Euronymous for providing an excellent, well-thought and informative article
>and I hope everyone enjoys examining a new dimension in semiconductor advances.

That was an excellent read indeed, thanks!

Using the P4 to illustrate the potential was quite interesting as well. The "hotspots" issue - the change from 99 to 113 degrees - seems to be a concern, so that seems to be one obstacle to fully getting the best of both worlds as per article.
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3D Integration article by new authorDavid Kanter2007/05/06 07:50 PM
  3D Integration article by new authorrwessrl2007/05/07 01:10 AM
    3D Integration article by new authorslacker2007/05/07 01:40 AM
      3D Integration article by new authorrwessel2007/05/07 01:57 AM
        3D Integration article by new authoryoyo2007/05/07 05:47 AM
  3D Integration article by new authorWierdo2007/05/08 05:57 AM
  3D Integration article by new authorMarcin Niewiadomski2007/05/10 12:14 PM
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