I'd like to thank Euronymous, our newest contributor, who has just posted an article to RWT from MICRO-39.

This report details one of the most important future technologies for semiconductors: three dimensional integration. Academic and industrial researchers at Intel and IBM have made it clear that 3D integration is the future for semiconductor manufacturing. This report explains the major motivations and challenges for 3D integration, how this technique works, and the preliminary results that 3D integration can offer for modern microprocessors.

The article can be found at:
http://realworldtech.com/page.cfm?ArticleID=RWT050207213241

Thanks to Euronymous for providing an excellent, well-thought and informative article and I hope everyone enjoys examining a new dimension in semiconductor advances.


David