David Kanter (dkanter@realworldtech.com) on 5/6/07 wrote:
---------------------------
>I'd like to thank Euronymous, our newest contributor, who has just posted an article to RWT from MICRO-39.
>
>This report details one of the most important future technologies for semiconductors:
>three dimensional integration. Academic and industrial researchers at Intel and
>IBM have made it clear that 3D integration is the future for semiconductor manufacturing.
>This report explains the major motivations and challenges for 3D integration, how
>this technique works, and the preliminary results that 3D integration can offer for modern microprocessors.
>
>The article can be found at:
>http://realworldtech.com/page.cfm?ArticleID=RWT050207213241
>
>Thanks to Euronymous for providing an excellent, well-thought and informative article
>and I hope everyone enjoys examining a new dimension in semiconductor advances.
>
>
>David

That was an excellent read indeed, thanks!

Using the P4 to illustrate the potential was quite interesting as well. The "hotspots" issue - the change from 99 to 113 degrees - seems to be a concern, so that seems to be one obstacle to fully getting the best of both worlds as per article.